Mini V Series
Economical, Bench Top X-Ray Systems
Economical, Multi-Purpose Bench Top X-Ray Inspection Solution
The MiniV is capable of SMT solder joint verification,
bare board inspection and semiconductor package
inspection.
• Easy-to-use
• Excellent imaging quality
• Variable field-of-view
• Compact 29 x 37” (737 x 940mm) footprint
• 2-axis manipulator with tray
Related Topics 
Mini V
Bench Top
X-Ray Inspection System
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MiniV Datasheet (Printable PDF) |
| MiniV X-Ray Images | |
The MiniV is an economical, multi-purpose bench top x-ray inspection tool; designed for fast 2-D solder quality inspection, component inspection and rework verification.
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75kV, 33 micron
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Board Handling: up to 18Wx 21H” (432W x 533Hmm) |
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Sample Door: 29(W) X 5.5(H)” (737W X 140Hmm) |
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Footprint: 37(W) x 29(D) x 32(H)” (940W x 737D x 813Hmm) |
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Magnification: variable to 50X |
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Field-of-View: up to 2“ (50mm) |
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Safe: CE certified and exceeds all CDRH and FDA safety and radiation requirements. |
| Quality Inspection Applications | |
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Solder quality and voiding inspection |
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SMT/PTH, CSP, BGA, QFN and connectors |
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Bare board mis-registration and drill offset |
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Rework Verification |
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Counterfeit Device Screening |
Controls and Indicators
Optional Accessories
• Mobile stand (steel frame w/ casters).
*Safety Requirement: The Bench Top MiniV
requires a heavy-duty bench capable of holding
600lbs.
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Emergency OFF switch |
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Safety Interlock Indicators |
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ESD Ground strap terminal |
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Keyed main power switch |
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X-ray on/off switch |
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X-ray: KV and mA controls |
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Camera: 2/4" I.I., zoom and gain controls |
• Flat Panel Display: 19” (480mm) LCD
• Network Ready: Ethernet 10/100 base-T
• Image Processor: Verifier VIP (standard)
